3D X-ray Inspection Service

With the proliferation of complex PCBAs, inspection is a crucial element in the PCB Assembly process. At NeuronicWorks, our team works to provide high-quality PCBAs that perform reliably in demanding applications across industries. To ensure this, we perform intensive quality checks both manually and automatically at every step of the assembly process.

In addition to Automated Optical Inspection (AOI), NeuronicWorks uses a 3D X-Ray Inspection system specifically designed for high-quality 3D X-ray inspection in printed circuit board assembly.

Some of the issues that can be detected include lifted lead, missing components, misaligned/misplaced components, solder bridges, insufficient solder, solder voids, excess solder, BGA shorts, improper reflow soldering and more. In addition to detecting issues in the PCB Assembly, the X-ray reports and helps our manufacturing team to determine the root cause of a given defect.

The type of components we can inspect including BGA, LGA, leadless components with exposed pad (UFDFN, VFDFN, WFDFN, VFQFN, TFQFN, WFQFN, LFCSP-UD, WLCSP, XFBGA) DFN, QFN, and all other complex components.

The type of components we can inspect including BGA, LGA, leadless components with exposed pad (UFDFN, VFDFN, WFDFN, VFQFN, TFQFN, WFQFN, LFCSP-UD, WLCSP, XFBGA) DFN, QFN, and all other complex components.

We provide quick turnaround X-ray inspection services to customers while they wait at our facility or work together with our team. The boards can also be shipped to us directly for this service.

At NeuronicWorks, we have the NORDSON DAGE Quadra 3 X-ray inspection system which is specifically designed for high-quality X-ray inspection in printed circuit board assembly production applications. Delivering uninterrupted operation at 0.95µm, the system is suitable for detecting a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit devices screening.